Solderless breadboard 830 Tie Points – Adhesive Back – Detachable Power Lanes
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CAD 5.80
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Description
This is the larger 830 tie-point breadboard. The back side has an adhesive pad on it, to stick the breadboard to any flat and clean surface.
The 2 power lanes are detachable, and all parts (main panel and power lanes) are tongued and grooved. This way, you can build your own supersized breadboard.
Each board is 165 x 55 mm x 8.5 mm and can accept solid patch wires with a diameter of 0.3 to 0.8 mm diameter (AWG 20-29).
The maximum current per lane must not exceed 5A, the insulation voltage between the lanes is 300V, and must not be exceeded as well.
Check out the CANADUINO® Breadboard Power Supply and USB-UART Module:
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